Glass Cutter “ULTILE”, Suited for R&D

This cutter is used for cutting a wide variety of substrates for experimental use, including ordinary glass, silicon wafers, and sapphire crystalline substrates. Even beginners can easily cut substrates with its unique and patented functions, such as blade height adjustment and pressure adjustment. In addition, eight types of cutters are available for cutting substrates into sizes optimal along with the purposes of each R&D.